July 2, 2022


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Intel lastly responds to flexing of twelfth Gen Alder Lake processors on LGA1700 motherboards

by way of AnandTech

Intel has performed a great job with its twelfth Gen Alder Lake processors by way of chip efficiency. Nevertheless, Alder Lake-S desktop processors have been reported to bend for a very long time when positioned inside their Socket LGA1700 motherboards. For instance, even reviewers like AnandTech, amongst others, have observed the difficulty (picture above).

Intel has lastly responded to all these experiences. In an announcement to Tom’s {Hardware}, the corporate stated that bending of the built-in warmth sink (IHS) shouldn’t trigger a serious downside and that this kind of deflection is frequent. Right here’s the corporate’s full assertion:

We haven’t acquired any experiences of twelfth Gen Intel Core processors working out of specification on account of modifications to the built-in warmth sink (IHS). Our inside information exhibits that the IHS on twelfth Gen desktop processors could exhibit slight deviation after putting in into the socket. Such minor deviation is predicted and doesn’t trigger the processor to function out of specification. We strongly advise towards any modification of the sleeve or impartial loading mechanism. Such modifications will trigger the processor to function outdoors of specification and should void any product warranties.

The issue appears to stem from the Unbiased Loading Mechanism (ILM) of the LGA1700, because the obvious uneven strain appears to bend the processor when mounted inside its socket.

Here’s a comparability of before-after photos of the incident:

As you may see above there’s a clear hole between the flat surfaces of the cooler and the IHS indicated by the seen mild between the chip and the cooler when positioned contained in the socket. It’s also possible to watch this video under by Jisaku Hibi which exhibits the bend in motion:

Tom’s {Hardware} additionally posed further inquiries to Intel concerning how the flex might have an effect on numerous efficiency points and the well-being of the processor in addition to the socket which you’ll learn under. The Intel spokesperson’s responses are emboldened.

  • Are modifications deliberate within the design of the ILM? This situation could solely exist with sure variations of the ILM. Are you able to verify that these ILMs are inside specs?
    • Based mostly on present information, we can not attribute the IHS deviation variation to any particular vendor or socket mechanism. Nevertheless, we’re investigating any potential points alongside our companions and prospects, and can present additional recommendation on related options the place acceptable.
  • Some customers report decreased warmth switch because of the deflection concern, which is smart because it clearly impacts the IHS’s capacity to mate with the cooler. Would Intel RMA the chip if the mating was poor sufficient to trigger thermal throttling?
    • Minor IHS deviation is predicted and doesn’t trigger the processor to function outdoors of specification or forestall the processor from assembly revealed frequencies below acceptable working situations. We suggest that customers who observe useful points with their processors contact Intel Buyer Service.
  • The chip deflection concern additionally impacts motherboards – because of the deflection on the chip, the socket finally ends up bending the again of the socket, and thus the motherboard. This will increase the opportunity of damaging traces passing via the motherboard circuit board, and so on. Is that this situation additionally inside specification?
    • When there’s backplate flex on the motherboard, the deformation is attributable to the mechanical load positioned on the motherboard to make electrical contact between the processor and the socket. There is no such thing as a direct correlation between IHS deflection and backplate deflection, besides that they’ll each be attributable to the mechanical loading of the socket.

For these questioning if there’s an unofficial resolution to the issue, there’s a puck mod that has been examined by Igor’sLAB. Nevertheless, Intel has warned that such and different modifications will void your guarantee.

Supply: Tom’s Materials